FILE DUMP EMMC SAMSUNG GALAXY J1 MINI SM-J105F

FILE EMMC DAN FIRMWARE SEMUA ANDROID FILE DUMP SAMSUNG Insertion test... Done. Init bus... VCC: 3.3 V, VCCQ: 3.0 V Bus: 1 bit (SDR 52MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V) Card/BGA: BGA (Discrete embedded) - High density MMC Manufacturer ID: 0x15 (Samsung) Product name: FN12MB (0x464e31324d42), rev: 0x00, serial number: 0x01292263 Manufacturing date: Jun 2016 CID: 15010046 4E31324D 42000129 2263631E CSD: D0270132 0F5903FF F6DBFFEF 8E40400C EXT_CSD revision: 1.7 (MMC v5.0, v5.01) Partition info: Boot1: 4096 KiB Boot2: 4096 KiB RPMB: 512 KiB User area: 7.28 GiB(7,818,182,656 bytes) Cache size: 64 MiB Partition configuration: 0x08 No boot acknowledge is sent (default) Boot partition 1 is enabled for boot Partitioning support: 0x07 Device support partitioning feature Device can have enhanced technological features Device partitioning possible Boot configuration protection: 0x00 Boot bus conditions: 0x00 Boot area wr...